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HomeAccessory Arctic Silver 5 High Density Polysynthetic Silver Thermal Paste Compound
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Arctic Silver 5 High Density Polysynthetic Silver Thermal Paste Compound

$12.95

With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability.
Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heat sinks or water-cooling solutions.
Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heat sinks or water-cooling solutions.
Controlled Triple-Phase Viscosity
Not Electrically Conductive

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SKU: L-AS5-3.5G Category: Accessory
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  • Description
  • Additional information
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Description

Arctic Silver 5 High Density Polysynthetic Silver Thermal Compound 3.5 Gram Syringe
With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability.
Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heat sinks or water-cooling solutions.

Features
Made With 99.9% Pure Silver
High-Density
Controlled Triple-Phase Viscosity
Not Electrically Conductive
Absolute Stability

Specifications
Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: ?50?C to >180?C
Long-Term: ?50?C to 130?C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads
when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates.

Package Included
1 x AS5-3.5G Syringe

Additional information
Weight0.05 kg
Shipping & Delivery

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